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Call for Papers

The Symposium Hotel Room Block is now available!

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Booking Code: IEEE2020

Get Ready for INERTIAL 2020!

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Key Dates

Please note those important deadlines

Please note the Key Dates below so you don’t miss any important deadlines.

Abstract Submission

October 22, 2019

Late News Submission Opens

December 8, 2019

Acceptance Notification

December 8, 2019

Full Paper Submission & Author Registration

February 1, 2020

INERTIAL 2020

Hiroshima, Japan

This exclusive international Symposium on Inertial Sensors and Systems will be held
in Hiroshima, Japan. The event continues our annual tradition of informal single-track
international meetings discussing the latest developments in the area of modern
inertial sensors and emerging applications. The INERTIAL 2020 will be a four-day event
with one day of tutorials, and three days of technical sessions.


INERTIAL 2020 will be held at the Grand Prince Hotel Hiroshima. The hotel stands
directly by the beautiful Seto Inland Sea, a 40 minute train ride from Hiroshima Station.
Hiroshima Prefecture is located in the southwestern part of the Japanese islands. It is rich
in the natural beauty of the Inland Sea and the Chugoku Mountains, with mountains,
sea, rivers, valleys, plains, basins that characterize Japan’s landscape.

Topic Areas

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Call For Papers

Calling All Authors

Call for Papers

Registration

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INERTIAL 2020

Topics

  • Sensors Phenomena & Modeling
    Theory, new physical principles, deviceand-
    system-level modeling, multiphysics,
    deterministic/stochastic error
    models, predictive models
  • Sensor Systems & Electronics
    Sensor arrays, multi-sensor units, inertial
    measurement units, sensor electronics,
    actuator systems,control of sensors
  • Atomic/Quantum Sensors
    Theory, new physical principles, deviceand-
    system-level modeling, multiphysics,
    deterministic/stochastic error
    models, predictive models
  • Low-cost Manufacturing
    Wafer-level fabrication, new micro/
    nano techniques, new materials, built-in
    diagnostics

     
  • Advanced Packaging
    Wafer-level, system-in-package, vacuum/
    differential packaging
  • Advanced Test & Evaluation
    Low-cost test/evaluation, calibration of
    arrays, wafer-level test and evaluation
  • Aiding Technology
    Hybrid systems, gravitational maps, startrackers,
    vision
  • Emerging Applications
    Consumer electronics, medical devices,
    sport and fitness, automotive, oil/gas
    exploration, military, aeronautical and
    space sensor systems
  • Best Failed Ideas
    Once exciting ideas for sensors, systems,
    components, supporting subsystems,
    or methods that in the end proved
    unsuccessful for practical or fundamental
    reasons

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